A comprehensive engineering verification system ensures that the design is manufacturable, testable, and mass-producible (EVT/DVT/PVT/MP).
Flexible matching of turnkey, OEM, processing with supplied materials,and hybrid models; global material procurement and resilient management.
25 high-speed SMT production lines, precision placement covering ±0.025mm, 01005, 0.3mm pitch, and POP processes.
A comprehensive 3D SPI/AOI/X-RAY/ICT/FCT inspection matrix ensures quality control at every level, from solder joints to functionality.
The MES system provides full traceability, meeting global compliance and ESG requirements.
A professional engineering team supports DFM manufacturability analysis and new product introduction, accelerating the transformation of products from design to mass production.
Component selection and substitution, BOM cost optimization, and full material procurement are achieved through an SRM system to ensure transparent and traceable supply.
High-speed placement line and precision printing process support high-precision placement of complex packages such as 01005 micro-devices, BGA, and QFN.
Complete process coverage including DIP, wave soldering, selective soldering, and manual soldering, meeting the needs of mixed-assembly boards and high-reliability soldering.
ICT, FCT, programming, aging, and environmental reliability testing, building a comprehensive quality control system from components to the finished products.
From PCBA to complete system integration, wiring harness assembly, structural assembly and finished product packaging, delivery is ready for global market.